Process Engineer Internship in NXP Semiconductors
Job Experience
Process Engineer Internship
NXP Semiconductors
June 2016 to August 2016
? Worked as an intern for 320 hours for the position of die-bond and wire-bond process engineer
? Underwent training for 5S, process engineering and failure analysis of resulting products
Education
BS Materials Engineering
University of the Philippines - DilimanCurrently studying
Languages
IT skills
Other Skills
More Czerr Eljohn
Career Goals
Industries of interest
Areas of interest
Availability to travel and work outside the city
No