Final Year Project (Numerical Simulation of Encapsulation Process During Electronic Packaging) in Universiti Sains Malaysia
Job Experience
Final Year Project (Numerical Simulation of Encapsulation Process During Electronic Packaging)
Universiti Sains Malaysia
February 2014 to July 2014
I have done Final Year Project title "Numerical Simulation of Encapsulation Process During Electronic Packaging" Objective: ? Study the simulation of encapsulation technology for stack-chip scale packaging (S-CSP) using ANSYS FLUENT 14.5 ? Analysis void formation during encapsulation of S-CSP using different parameter ? Conduct effective failure analysis on electronic packages ? Validation of Simulation software
Intership student
AK Dynamic Manufacturing Sdn Bhd (Pharmacetical Plastic Product)
July 2013 to September 2013
Doing internship at AK Dynamic Manufacturing Sdn Bhd company which produce the pharmacetical plastic product , bottle cap and canister bottle. During internship , learn about how to handle the injection molding and blow molding, service and repair the injection machine if the problem occur. I am also learn how to doing inspection to product , testing as well as doing quality control to product. Besides learn about common defect occur such as black dot, shot mould and etc and carry out troubleshooting.
Internship
AK Dynamic Manfactring
June 2013 to September 2013
Security
Advanced Micro Devices Export Sdn Bhd (AMD)
May 2012 to August 2012
- Learn how to manage time well and self motivated. - familiar to adapt enviromental of work. - work in team
Fresh Graduate
Universiti Sains Malaysia Kampus Kejuruteraan
June 2010 to June 2014
I have done Bachelor Degree in Polymer Engineering at USM Nibong Tebal, Penang Engineering Campus. I am a fresh graduate looking for a engineering job.
Education
Bachelor's degree
[Otra]Universiti Sains Malaysia Kampus Kejuruteraan (Malasia)January 2010 to January 2014
High School Certificate
[Otra]Maktab Rendah Sains Mara Kuala Krai (Malasia)January 2006 to January 2008
PMR
[Otra]Sekolah Menengah Kebangsaan Dato Perdana (Malasia)January 2004 to January 2006
Polymer Engineering
Universiti Sains MalaysiaCurrently studying
Languages
English
Basic
IT skills
AutoCAD essentials 2D, microsoft excel, microsoft visual basic
Medium
Other Skills
More Hafiz
Career Goals
The main objective is to obtain a respectable position and set up to the challenges of working as a engineer in the industry. Besides, develop my engineering skills while contributing to the organization?s growth and become an asset to the organization. Expected remuneration : RM 2500-2800 (Per month) ? Fluent both written and spoken in English and Bahasa Malaysia. ? Able to work individually and in teamwork with minimum supervision. ? High enthusiasm to explore, accept changes and new challenges, self-motivated. ? Have good leadership, interpersonal and communication skills, hardworking, self-reliance and willing to learn.
Industries of interest
Areas of interest
Availability to travel and work outside the city
No
Interests and hobbies
Polymer Engineering , rubber , plastic , oil and gas , semiconductor.